Electrolytic Grade Tinned Copper Foil and Wire

High Quality Electrolytic Grade Copper Foil is coated with 100% lead free tin to prevent corrosion and any chemical reactions, which is usually associated with the use of bare copper. The tinning is done by Hot Dip Method which ensures solder ability and 100% coverage.

Standard Coating: 5 microns.

Availability: Available in continuous length. Base copper foil thickness from 0.05mm (50 microns) up to 1mm and width from 5mm up to 150mm. Base copper wire thickness from 0.8mm onwards.

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